The Mini Bump Probe F10037B030G180 (item number 1168545) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.3 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 2.54 mm / 100 mil and 180 cN spring force, F10037B030G180 combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 5 A. The design of F10037B030G180 transfers fine-pitch contacting principles to a robust ICT probe specifically matched to mini-bump geometries.
