Technical data
| General | |
|---|---|
| Structure | Basic Contact Probe |
| Type/family | F100 |
| Pitch (mm/mil) | 2,54 / 100 |
| Temperature | -45°C...+80°C |
| Dimensions | |
|---|---|
| Total length (mm) | 33.3 |
| Protrusion height (mm) | 8.5 |
| Tip style diameter (mm) | 0.3 |
| Barrel diameter (mm) | 1.37 |
| Materials and surfaces | |
|---|---|
| Tip style | 37 |
| Plunger material | Beryllium copper |
| Plunger plating | Gold |
| Barrel material | Bronze |
| Barrel plating | Gold |
| Spring material | Spring steel |
| Spring plating | Silver |
| Mechanical specifications | |
|---|---|
| Preload (cN) | 80 |
| Spring force (cN) | 180 |
| Nominal travel (mm) | 4.3 |
| Maximum travel (mm) | 6.4 |
| Pointing accuracy +/- (mm) | 0.08 |
| Electrical specifications | |
|---|---|
| Continuous current (A) | 5 |
| Typical contact resistance (mOhm) | 20 |
Graphics
Beschreibung des Produkts
The Mini Bump Probe F10037B030G180 (item number 1168545) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.3 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 2.54 mm / 100 mil and 180 cN spring force, F10037B030G180 combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 5 A. The design of F10037B030G180 transfers fine-pitch contacting principles to a robust ICT probe specifically matched to mini-bump geometries.