Datos técnicos
| General | |
|---|---|
| Estructura | Basic Contact Probe |
| Tipo/Familia | F075 |
| Paso (mm/mil) | 1,90 / 75 |
| Temperatura | -45°C...+80°C |
| Dimensiones | |
|---|---|
| Longitud total (mm) | 33.1 |
| Altura sobresaliente (mm) | 8.5 |
| Diámetro del estilo de punta (mm) | 0.3 |
| Diámetro del casquillo (mm) | 1.02 |
| Materiales y superficies | |
|---|---|
| Estilo de punta | 37 |
| Material del émbolo | Beryllium copper |
| Recubrimiento del émbolo | Gold |
| Material del casquillo | Bronze |
| Recubrimiento del casquillo | Gold |
| Material del resorte | Spring steel |
| Recubrimiento del resorte | Silver |
| Especificaciones mecánicas | |
|---|---|
| Precarga (cN) | 70 |
| Fuerza del resorte (cN) | 150 |
| Recorrido nominal (mm) | 4.3 |
| Recorrido máximo (mm) | 6.4 |
| Precisión de punteo +/- (mm) | 0.08 |
| Especificaciones eléctricas | |
|---|---|
| Corriente continua (A) | 4 |
| Resistencia de contacto típica (mΩ) | 20 |
Gráficos
Beschreibung des Produkts
The Mini Bump Probe F07537B030G150 (item number 1168129) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.3 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 1.90 mm / 75 mil and 150 cN spring force, F07537B030G150 combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 4 A. The design of F07537B030G150 transfers fine-pitch contacting principles to a robust ICT probe specifically matched to mini-bump geometries.